C17510 CuNi2Be Beryllium Copper Plate
C17510 CuNi2Be Beryllium Copper Plate 140mm*45mm*2000mm Used In Industry Application
Product Normal Description:
Product Name: Beryllum copper plate
Grade: C17510, CuNi2Be
Standard: ASTM B534
Product Size: 140mm x 45mm x 2000mml
State: TF00
Typical Application: Industry
Product Brand: CUBERYLLIUM®
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Product Details


PRODUCT DESCRIPTION

C17510 CuNi2Be Beryllium Copper Plate 140mm*45mm*2000mm Used In Industry Application

Product Normal Description:

Product Name: Beryllum copper plate

Grade: C17510, CuNi2Be

Standard: ASTM B534

Product Size: 140mm x 45mm x 2000mml

State: TF00

Typical Application: Industry

Product Brand: CUBERYLLIUM®

Chemical Composition


CUBERYLLIUM® BrandUNS-NumberBerylliumNickelFeSiCopper
Cuberyllium-C751C175100.20-0.601.4~2.2<0.1<0.2Balance

Note: Copper plus additions equal 99.5% Minimum.


Beryllium Copper Alloys

Beryllium copper (C17200 & C17300) is an age-hardening alloy which attains the highest strength of any copper-base alloy. It may be age-hardened after forming into springs, intricate forms or complex shapes. It is esteemed for spring properties, erosion obstruction, soundness, conductivity, and low creep.

Tempered beryllium copper is C17200 and C17300 that has been age solidified and cold drawn. No further heat treatment is essential past a potential light pressure alleviation. It is adequately flexible to twist without anyone else measurement and can be framed into springs and most shapes. The tempered wire is most valuable where the properties of beryllium copper are wanted, yet the age solidifying of completed parts isn’t useful.

C17510 and C17500 beryllium copper alloys are age-hardenable and give great electrical conductivity, physical properties, and perseverance. They are utilized in springs and wire where electrical conduction or maintenance of properties at raised temperatures is significant.

High-quality beryllium copper combinations contain as much as 2.7% beryllium (cast), or 1.6-2% beryllium with about 0.3% cobalt (created).

High conductivity beryllium copper combinations contain as much as 0.7% beryllium with some nickel and cobalt. The thermal conductivity of these amalgams is more prominent than aluminum and somewhat not exactly unadulterated copper and are regularly utilized as electrical contacts.


Typical Physical Properties of C17510 CuNi2Be Beryllium Copper Alloy


PRODUCT PROPERTYUS CUSTOMARYMETRIC
Coefficient of Thermal Expansion9.8 . 10-6 per oF (68-392 F)17.6 . 10 6 per C (20-200 C)
Density0.317 lb/in3 @ 68 F8.77 gm/cm3 @ 20 C
Electrical Conductivity48 %IACS @ 68 F0.281 MegaSiemens/cm @ 20 C
Electrical Conductivity45 %IACS @ 68 F0.263 MegaSiemens/cm @ 20 C
Electrical Resistivity22.8 ohms-cmil/ft @ 68 F3.79 microhm-cm @ 20 C
Melting Point Liquid US1955 F1068 C
Melting Point Solid US1885 F1029 C
Modulas of Elasticity in Tension19200 ksi132400 MPa
Modulas of Rigidity7500 ksi51710 MPa
Specific Gravity8.778.77
Specific Heat Capacity0.1 Btu/lb/F @ 68 F419.0 J/kg . K at 293 K
Thermal Conductivity120.0 Btu . ft/(hr . ft2 . F) @ 68 F207.7 W/m . K at 20 C

Typical Applications of C17510 CuNi2Be Beryllium Copper Alloy


Bearings and bushes
Plastic moulds
Corrosion resistant components
Current carrying springs
Welding electrodes
Electrical and electronic connectors

Weldability

Soldering, brazing, gas shielded arc welding, coated metal arc welding, spot welding, seam welding and butt welding are all recommended

Corrosion Resistance

Alloy 751’s corrosion resistance is similar to pure copper. It resists corrosion in sea water, most organic solutions, non- oxidizing acids, and dilute alkalis. Alloy 751 is not subject to hydrogen embrittlement, and it resists stress corrosion cracking in sulfide and chloride solutions. Alloy 751 is not recommended for use with ammonium hydroxide or strongly oxidizing acids.

Fabrication

Key Technology of Beryllium Copper(Heat treatment)

Age Hardening

Age hardening significantly enhances the material’s strength. This reaction is generally carried out at temperatures between 260°C and 540°C depending on alloy and desired characteristics. This cycle causes the dissolved beryllium to precipitate as a beryllium rich (gamma) phase in the matrix and at the grain boundaries. It is the formation of this precipitate which causes the large increase in material strength. The level of mechanical properties attained is determined by the temperature and time at temperature. It should be recognized that beryllium copper has no room temperature aging characteristics.


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